Industrial-Grade eSIM Embarks In Miniaturized Package

Infineon Technologies has launched what is calling the world's first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). The company believes manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers can optimize the design of their IoT devices without compromising on security and quality.

 

Providing robust quality on a miniature footprint that works even under the harshest conditions remains a challenge for chip makers. Infineon's SLM 97 security controller in a Wafer Level Chip Scale Package (WLCSP) measures 2.5 mm x 2.7 mm, specifies an operating temperature range of -40°C to +105°C, and provides a feature set fully compliant with the latest GSMA specifications for eSIM.

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Embedded Technologies Expo & Conference (ETC), in the largest embedded and IoT market in North America, is the ONLY event focused on what is most important to designers and implementers – education and training. Attendees will experience over 100 hours of unparalleled education and training covering embedded systems, IoT, connectivity, edge computing, AI, machine learning, and more. Co-located with Sensors Expo & Conference, attendees will have the opportunity to see hundreds of leading exhibitors and network with thousands of industry peers and innovators.

 

The chip in WLCSP is available in volume quantities now. For more information, SLM97 datasheets are available.

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