High-Density Edge Card Sports Ultra-Fine Pitch

Samtec unveils the MEC5, what it is calling the industry’s first 0.5-mm pitch edge card socket with justification beam. Reportedly, this design meets the demands for decreased size and increased speeds, while also optimizing cost. The socket’s justification beam is designed to shift the card into proper alignment with the contacts. This allows for standard board tolerance on cards that would typically not work with ultra-fine pitch connectors. This optimizes manufacturing costs with a 30-50% PCB cost savings and a high yield for standard cards.

 

Available in both vertical (MEC5-DV) and right-angle (MEC5-RA), this socket features up to 300 total I/Os for high-density applications. To meet demands for speed, the vertical socket is designed for 28 Gbps NRZ/56 Gbps PAM4 performance. Both orientations are designed to handle PCIe Gen 4 signaling.

EMBEDDED TECHNOLOGIES EXPO & CONFERENCE

The inaugural event will take place June 25-27 in San Jose, CA!

Embedded Technologies Expo & Conference (ETC), in the largest embedded and IoT market in North America, is the ONLY event focused on what is most important to designers and implementers – education and training. Attendees will experience over 100 hours of unparalleled education and training covering embedded systems, IoT, connectivity, edge computing, AI, machine learning, and more. Co-located with Sensors Expo & Conference, attendees will have the opportunity to see hundreds of leading exhibitors and network with thousands of industry peers and innovators.

 

Rated to 1.5A per contact, this system accepts 1.6-mm thick cards and features standard alignment pins and card polarization. Choice of through-hole or surface mount rugged weld tabs are available for a secure connection to the board. For more detailed information, checkout the Micro Edge Card Systems.

 

Samtec Inc.

New Albany, IN

800-726-8329

http://www.samtec.com

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