3D NAND UFS 2.1 Flash Drive Fortifies High-End Smartphones

Western Digital launches what it claims is the industry’s first 96-layer 3D NAND UFS 2.1 embedded flash drive (EFD). The iNAND MC EU321 promise to accelerate the possibilities of artificial intelligence (AI), augmented reality (AR), multi-camera high-resolution photography, 4K video capture, and other demanding applications for high-end mobile and compute devices.

 

The iNAND MC EU321 is the latest addition to the iNAND family, which has been deployed in major smartphone and tablet devices for more than a decade. The iNAND MC EU321 EFD achieves sequential write performance speeds up to 550 MB/s.  Western Digital is currently sampling storage solutions to OEMs in capacities up to 256 GB. For more details, contact Western Digital.

Embedded Technologies Expo & Conference

The inaugural event will take place June 25-27 in San Jose, CA!

Embedded Technologies Expo & Conference (ETC), in the largest embedded and IoT market in North America, is the ONLY event focused on what is most important to designers and implementers – education and training. Attendees will experience over 100 hours of unparalleled education and training covering embedded systems, IoT, connectivity, edge computing, AI, machine learning, and more. Co-located with Sensors Expo & Conference, attendees will have the opportunity to see hundreds of leading exhibitors and network with thousands of industry peers and innovators.

Suggested Articles

Acquisitions yield diverse products and services.

Unique function enables measurement of two liquids with a single unit.

1650-nm pulsed DFB laser diode module groomed for optical test equipment applications.