Low Capacitance TVS Diode Arrays Deliver High Signal Integrity at High Operating Voltages with Low Leakage

CHICAGO, IL --- Littelfuse, Inc. introduces two series of low capacitance TVS Diode Arrays optimized for protecting the Near Field Communication (NFC) circuits of smartphones, tablets and other portable communication products from ESD damage. The SP3118 and SP3130 Series TVS Diode Arrays include back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology that absorb repetitive ESD strikes safely up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. Their back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. The SP3118 and SP3130 Series provide best-in-class leakage performance when compared with other industry solutions. Low leakage current performance is essential for any component used in battery-operated, power hungry devices.

“The nominal voltages for the data antenna lines that the SP3118 and SP3130 Series are designed to protect are less than 3V. During antenna mismatch events, the interfaces of these products may experience up to five times the nominal voltage encountered during an NFC handshake,” said Tim Micun, product manager/TVS Diode Arrays. “These new TVS Diode Arrays permit the elevated signal voltages to pass and distinguish them from ESD events.”

SP3118 and SP3130 Series TVS Diode Array offer these key benefits:
• Their low capacitance (0.3pF @ VR=0V) minimizes signal degradation or attenuation for high-speed data, giving engineers more signal margin in their designs.
• Ultra-low leakage at max reverse standoff voltage (VRWM) helps to preserve battery life and signal integrity. Excessive leakage can be seen as additive capacitance for a high-speed differential pair.
• Enhanced ESD capability (±10kV contact, ±15kV air) permits manufacturers to achieve ESD protection beyond the maximum level stated in the IEC standard and protects against a multitude of other threats to ensure product reliability in the field.
• Small form factors (SOD882 for SP3118-01ETG and SP3130-01ETG; 0201 flip chip for SP3118-01WTG and SP3130-01WTG) save precious board space, simplify the PCB layout, and allow for protection in space-constrained applications like smartphones.


The SP3118 and SP3130 Series are provided in tape & reel packaging in quantities of 10,000.
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