Sanmina’s Backplane and Cable Division are developing new flex and rigid flex-circuit assembly capabilities for military and aerospace electronics equipment. The circuit assemblies pair the latest laminates, mil-aero connector, with the company’s advanced circuit fabrication technologies. Its flex and rigid flex technology reportedly results in a smaller form factor, reduced weight, and cost savings. Additionally, Sanmina's flex and rigid flex circuit fabrication technology is able to deliver data rates up to 10 to 15 Gbits/s.
San Jose, CA