ST. FLORIAN, Austria /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced that EPCOS AG, a leading electronic components, modules, and systems manufacturer, selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany. EPCOS is using EVG's wafer bonder to manufacture surface acoustic wave (SAW) filters embedded in RF devices for a variety of applications, including GPS navigation equipment, mobile phones, and home entertainment systems.
"As we continue to innovate and further strengthen our SAW filter product portfolio, we are looking to partner with equipment suppliers who can address our stringent performance needs," said EPCOS's Christian Bauer, process development, SAW components. "Simultaneously, we're also looking for suppliers that offer flexible solutions, along with value-added process expertise, that will enable us to explore emerging markets, such as MEMS. Ultimately, we selected EVG's GEMINI bonder as it offered us superior process reliability, as well as throughput and yield in line with our requirements."
Paul Lindner, EVG's Executive technology director, noted, "The opportunity to work closely with EPCOS for its high-volume manufacturing needs has tremendous significance for EVG. This order win is testament not only to the performance capabilities of our wafer bonding solutions, but also to the continued inroads we've made into the high-volume market. We look forward to ongoing opportunities to work closely together with EPCOS to enable their current and future manufacturing needs."
EVG's GEMINI platform is a field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D IC integration, and advanced packaging, as well as compound semiconductor applications. With more than 100 automated wafer bonder installations worldwide, the GEMINI is designed for the lowest total cost of ownership and quickest return on investment. This fully automated wafer bonding system integrates EVG's precision alignment accuracy and wafer handling expertise into one wafer-bonding platform.
EPCOS AG is a leading manufacturer of electronic components, modules, and systems headquartered in Munich. With its broad portfolio, EPCOS offers a comprehensive range of products from a single source and focuses on fast-growing and technologically demanding markets, in particular in the areas of information and communication technology, automotive electronics, industrial electronics, and consumer electronics. The EPCOS Group has design and manufacturing locations and sales offices in Europe, Asia, and North and South America.
Electronic components are found in every electrical and electronic product and are indispensable for their flawless operation. Products from EPCOS store electrical energy, filter frequencies, and protect against overvoltage and overcurrent.
In fiscal 2008 (October 1, 2007, to September 30, 2008), EPCOS posted sales of €1.48 billion. At the end of the fiscal year, the company employed about 21,200 people worldwide.
EV Group is a world leader in wafer-processing solutions for semiconductor, MEMS, and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), and metrology equipment, as well as photoresist coaters, cleaners, and inspection systems.
In addition to its "dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS." Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator, compound semiconductor, and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea; and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges, and expedite device manufacturing in high volume.