Embedded In-Chip Sensing Subsystem Based On TSMC 7FF

Moortec Semiconductor’s embedded monitoring subsystem is based on TSMC’s 7-nm FinFET (FF) process. The subsystem employs the new 7-nm temperature sensor, described as a high-precision, low-power junction temperature sensor developed to be embedded into ASIC designs. It can be used for a number of different applications including Dynamic Voltage and Frequency Scaling (DVFS), device lifetime enhancement, device characterization and thermal profiling.

 

In addition, the 7nm Process Monitor provides the means for advanced node Integrated Circuit (IC) developers to detect the process variation of 7nm core digital MOS devices. The Process Monitor can be used to enable continuous DVFS optimization systems, monitor manufacturing variability across chip, gate delay measurements, critical path analysis, critical voltage analysis and also monitor silicon ‘ageing’.

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The subsystem also includes the sophisticated Process, Voltage and Temperature (PVT) Controller with AMBA APB interfacing, which supports multiple monitor instances, statistics gathering, a production test access port as well as other compelling features. Moortec’s PVT monitoring IP is designed to optimize performance in today’s cutting-edge technologies, solving the problems that come about through scaling of devices. Applications include Datacenter & Enterprise, Automotive, Mobile, IoT, Consumer and Telecommunications. More information is available on the company’s website.