Airborne Particle And MRS Sensors Make Semi Fabs More Efficient

CyberOptics’ next-generation APS3 airborne particle sensor with new ParticleSpectrum software promise to improve semiconductor fabs worldwide, The WaferSense APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles. Now in a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers leading accuracy and sensitivity valued by equipment and process engineers.


The APS3 employs ParticleSpectrum software, which provides a touch-enabled interface with user-friendly functionality, making it simple to read, record. and review small to large airborne particle data and see the effects of cleanings, adjustments and repairs in real-time. This technology used in back-end inspection applications is suited for IC package, wafer bump inspection, and mid-end semiconductor applications. For more information, visit CyberOptics.


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