Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies, so says the 3D TSV & 2.5D business update report by Yole Développement (Yole), part of Yole Group of Companies. The research firm investigates the advanced packaging industry and takes a closer look on the AI impact on this market.
Initially developed for niche markets including MEMS devices and memories for datacenters, 3D integration is entering in a new era. The world population increase, the exploding smartphones market, the development of new functionalities such as voice/image recognition… all these parameters directly contribute to the development of AI and deep learning solutions, all based on 3D integration technologies. AI is not a concept anymore but a reality that is skyrocketing the development of disruptive advanced packaging technologies.
Why do we need 3D TSV solutions, especially in high performance applications? According to Yole, benefits are numerous and are part of the major issues initially identified by the industrial companies. Bandwidth, latency and power consumption are the key words of these innovations. To read the complete story, CLICK HERE.