Wireless Applications

Melexis and BFi OPTiLAS Partner

September 1, 2009

BFi OPTiLAS will distribute Melexis' wireless integrated circuits in Europe.

YPRES, Belgium /PRNewswire-FirstCall/ -- Melexis, a leading supplier of mixed signal semiconductors, announces that France-based BFi OPTiLAS will join its' sales network as a distributor for the company's wireless ICs in Europe. Melexis RF product portfolio includes ISM band transmitters, receivers, and transceivers along with RFID and wireless sensor tags.

"In our opinion, BFi OPTiLAS offers a very good combination of industry knowledge and local presence in the areas of interest. Therefore we decided to add BFi OPTiLAS as a distributor for our Wireless ICs in Europe", said Dr. Andreas Laute, Business Unit Manager RF at Melexis.

"We are pleased to distribute the Wireless IC product portfolio of Melexis in the European marketplace", says Ernesto Prestifilippo, Business Development Director at BFi OPTiLAS. "The Melexis products have the cost effective, high-end performance that customers are looking for today."

Melexis is a leading designer and manufacturer of advanced Mixed Signal semiconductors, sensor ICs, programmable sensor IC systems and Wireless ICs.

BFi OPTiLAS is a technical distributor of specialist products and services to the electronic and optronics markets in Europe.

About Melexis
Melexis Microelectronic Integrated Systems N.V. (Euronext Brussels: MELE) designs, develops, tests and markets advanced integrated semiconductor devices. For over a decade, our customers in the automotive electronics market have inspired us to create, manufacture and deliver advanced Mixed Signal semiconductors, sensor ICs, and programmable sensor IC systems. The company sells its products to a wide customer base of automotive system manufacturers in Europe, North America and Asia. Melexis' products include microcontrollers, Hall (magnetic), optical sensor ICs, interface ICs for pressure and acceleration sensors, micromachined silicon pressure, acceleration and gyroscope sensors, application specific integrated circuits (ASICs), wireless communication RF and RFID components, in each case principally for automotive applications.

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