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September 6, 2013     

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Sensors Insights By Mike Granby

Making the “Connected Factory” a Reality
The factory of the future will still have PLCs and HMI panels, but someone half a world away will likely be monitoring and controlling them. That person may be sitting at a desk watching over a global network of facilities or checking the latest production statistics from a smartphone. Either way, the vision of the "Connected Factory" is evolving from concept to reality, as the explosive growth in machine-to-machine (M2M) connections, mobile devices in the enterprise, and wireless data traffic shows. continued

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Top News


Endress+Hauser to Buy Kaiser Optical Systems
The divestiture is part of Rockwell Collins' strategy to accelerate its focus on growth opportunities in its addressed markets, and the acquisition will expand Endress+Hauser's offerings in advanced analytics for liquids, gases, and solids. continued

U.S. Navy Awards Contract to Sparton and USSI
The $10.8 million subcontracts are for work to be performed under the ERAPSCO joint venture for the manufacture of sonobuoys. continued

Freescale Pursues New Financing
The company is seeking commitments for a new senior secured term loan facility under existing credit facilities to redeem, repurchase, or otherwise acquire senior secured notes and to pay related redemption premiums and fees. continued


China Sensor Output to Reach 3.1 Billion
According to Research and Markets' report, China's private and joint-ventured sensor products hold the low- and medium-end of the market, and high-end products are produced primarily by foreign manufacturers. continued

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LumaSense Introduces New Series 6 Pyrometer
The IR-based IMPAC IGA 6/23 was developed with a response time of 0.5 ms to enable precise measurements of dynamic processes and supports a temperature range that gives users additional options for process control. continued

ams to Create 3D IC Production Capacity
The patented technology promises to enable the design and production of radically improved IC packages that are smaller and offer better device performance than existing packages. continued

Sand 9 Unveils Precision MEMS Timing Products
The piezoelectric-enabled TM361 and TM061 challenge the dominance of quartz timing devices in applications for mobile phones and the emerging Internet of Things. continued

NXP Debuts Robust Capacitive Touch Switches
The family of self-calibrating capacitive touch and proximity switches promise to deliver reliable sensing despite contamination buildup on the touch area, and offer high immunity to temperature changes and electromagnetic interference. continued

Tensys TL-400 and TL-300 Receive CE Mark
The devices are the latest generation of continuous, noninvasive hemodynamic patient monitoring system. continued

Qualcomm Launches 2net Mobile
The remote patient monitoring gateway provides secure mobile medical device connectivity, enabling aggregation of clinical data from multiple medical device sensors into a unified stream on a variety of mobile devices. continued

EVG Unveils New Via-Filling Process
The NanoFill polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging provides void-free via filling of very deep trenches and high-aspect ratio structures for interposer development for 3D-integrated image sensors. continued

MDT Releases Banknote Validation Sensors
The new TMR magnetic sensors enable advanced magnetic pattern recognition and magnetic image retrieval for banknote validation in financial anti-counterfeit appliances. continued

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