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Sensors Weekly Newsletter
     timely news and insight from the sensor authority

March 16, 2012     

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Sensors Insights By Melanie Martella

Bring on the Driverless Cars
Robots are awesome. Robotic cars are even more so. I've been following the various iterations of the autonomous car for a while now and I swear they just keep getting better. Which is a very good thing, beyond the pure technical achievement of solving a highly complex problem, because as the population ages, a lot of folks are driving who really shouldn't be. continued

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Masimo Acquires Assets of Spire Semiconductor
The acquisition gives Masimo an advanced ability to develop custom components, accelerate development cycles, and optimize future product costs. continued


Global Remote Sensing Market to Grow
The Research and Markets report forecasts this technology segment will expand at a CAGR of 6.6% over the period 2011-2014; it also examines aerial remote sensing technology developments and trends. continued

Madison Company


Suomi NPP Satellite Completes Commissioning
The satellite's advanced-technology remote-sensing suite of instruments will observe many facets of our changing Earth. continued

AMEC Debuts New Etch Tool
The compact Primo TSV200E is built to provide ultra-high throughput for 200 mm wafer-level packaging, MEMS, and 3DIC applications. continued

SkyBitz Launches Intermodal Tracking System
The Galaxy Series uses patented Global Locating System technology to provide two-way global tracking and monitoring of the location and status of intermodal assets. continued

Sensors TV

TowerJazz Announces Hybrid CMOS Sensor Process
The TS11IS small geometry platform allows customers to design higher resolution high-end sensors, with smaller pixels and enhanced performance, for applications in high-end photography, machine vision, 3D imaging, and security sensors. continued

GE Introduces Portable Vibration Analyzers
The Bently Nevada SCOUT series performs a wide range of condition monitoring functions for the oil, gas, and power-generation industries, from route-based data collection to machinery analysis and balancing. continued

Twin Creeks Offers New Wafer Production System
The Hyperion produces wafers 90% thinner than conventional wafers and reduces the cost of solar cells, power electronics semiconductors, and other components. continued

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Shin-Etsu MicroSi and EVG Collaborate
Shin-Etsu MicroSi has joined EVG's open platform for temporary bonding materials for 3D IC manufacturing. continued

NASA and GM to Collaborate
The joint effort will develop robotic gloves that will help people do their jobs better and potentially reduce the risk of repetitive stress injuries. continued

UniPixel and Carestream to Collaborate
The two companies have entered into an agreement to manufacture and distribute Diamond Guard films, with the expectation that they will begin shipping pilot production orders to OEMs. continued

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