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Sensors Weekly Newsletter
     timely news and insight from the sensor authority

June 15, 2012     

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Sensors Insights By Ed Ramsden

Showstoppers at Sensors Expo
One of the best parts of Sensors Expo is getting to see new and interesting products, and getting to spend some time talking to the people who make them. While there were lots of neat sensors on display, I found a few especially memorable. continued

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Top News


ams wins "Best of Sensors Expo" Gold Award
The award was in recognition of the AS3935 Franklin lightning sensor, which can detect lightning up to 40 km away. continued

2012 "Best of Sensors Expo" Award Winners
Six gold, silver, bronze, and honorable mention awards were presented to companies for innovative products, based of potential impact, application, distinctiveness, timeliness, and availability. continued


MicroSense Acquires SigmaTech
The acquisition adds leading-edge wafer inspection tools to MicroSense's portfolio of metrology products. continued

COREwafer Delivers Test Technology to MDT
The Chinese manufacturer will use the on-wafer parametric test system to ensure the quality of magnetic field sensor switches used in smart utility meters. continued


Head-up Display Market to Grow
The MarketsandMarkets study "Head-Up Display (HUD) Market - Global Forecasts & Analysis (2012 - 2017), By Technologies, Components & Applications" predicts the market segment will reach $2.91 billion by 2017. continued

Sensors TV


Powerhouse Announces Energy Management System
The new eMonitor c-Series helps small businesses squeeze out inefficiencies, identify equipment problems, and reduce costs. continued

AER Completes GOES-R Satellite Design Review
The next-generation system will provide significant improvements over the current satellites, delivering better image resolution and more imagery coverage of the Earth's surface. continued


FlipChip and Fujikura to Collaborate
The two companies announced a strategic business agreement that allows both parties to combine technology development, design, sales, and marketing for the Chiplet and Chipset ultra-low-profile embedded semiconductor package product lines. continued

Terepac and Rockwell Automation to Collaborate
Based on the agreement, Rockwell Automation will work with Terepac to significantly increase production of micro circuits to support the Internet of Things. continued

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