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Sensors Weekly Newsletter
     timely news and insight from the sensor authority

July 13, 2012     

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Sensors Insights By Melanie Martella

July R&D Round Up
To distract those of us who are dealing with temperatures that feel more like surface-of-the-sun rather than Glorious Summer, how about some neat sensor-related research? This month we've got a biologically inspired technology to let robotic eyes act more like human ones and a new microchip that generates terahertz waves. continued

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Top News


Silex Microsystems Receives VINNOVA Grant
The funding will enable the consortium to expand volume production capabilities for MEMS-based gas sensors in Sweden. continued


Standex Acquires Meder
The acquisition expands the company's engineered product portfolio, worldwide sales, and engineering infrastructure. continued

FlipChip Acquires MMH
The acquisition will strengthen FCI's global product turnkey offerings for the coming generations of packaging in the smart phone, tablet, medical, and automotive markets, and it results in FCI securing controlling interest in Millennium Microtech (Shanghai). continued

Telit Establishes m2mAIR
The business unit will offer M2M managed and value-added services, including SIM management, remote module management, security, reporting and monitoring, SIM cards, rate-plans, and customer support. continued

Silicon Labs Acquires Ember
The strategic acquisition expands Silicon Labs' portfolio by adding the technology and software expertise required to enable low-power 2.4 GHz mesh sensor networks. continued

Automakers Award Three Contracts to CTS
The agreements are for the production of the company's Electronic Throttle Control accelerator pedal modules and pedal position sensors, with total revenues expected to reach approximately $25 million. continued


EVG's GEMINI Passes Equipment Assessment
The automated wafer bonding system for 3D IC wafer-to-wafer integration has passed the Equipment Maturity Assessment, implemented within SEMATECH's 3D Interconnect program, establishing its readiness for high-volume manufacturing. continued

IPS Launches IPS-EVAL-EH-02
The Wireless Environmental Sensor Energy Harvesting Evaluation Kit enables design engineers to develop and evaluate self-sustaining "green" sensor solutions, displacing the use of conventional batteries and supercapacitors. continued

Ziptronix Licenses Direct Bond Technology
The agreement licenses the technology for high-volume mobile handsets, underscoring direct bonding's value for applications beyond the image sensor market. continued

Zephyr Unveils Physiology Monitoring System
The PSM Training ECHO can monitor, transmit, and log the physiological status of up to 50 athletes simultaneously, using a new communications system, which allows coverage of an area larger than two American football fields, with no dead zones. continued


Bemis and ThinFilm to Collaborate
The companies will use printed electronics to develop high-volume flexible sensing packaging to collect, record, and wirelessly communicate key physical properties and environmental data in packaged perishable products. continued

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