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     timely news and insight from the sensor authority

July 12, 2013     

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Sensors Insights By Tom Kevan

Taking Up-Close-and-Personal to the Next Level
Since mobile devices have become firmly established in everyday life, a growing number of electronics have moved one step closer to interfacing with users in an up-close-and-personal way, like Google Glass and Pebble. Paralleling this trend is the growing role of sensing technology in these platforms. continued

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Top News


Flexpoint Updates Patents
The company will obtain additional protections against attempts to copy or pirate its automotive and BendTech designs. continued

Cathay Pacific Approves Sentry FlightSafe
The Hong Kong air carrier has signed off on the cellular-based M2M device, which provides real-time, global visibility of cargos, enabling remote monitoring of GPS and sensor data from origin to destination. continued


Teledyne Acquires Nova Sensors Shares
The company has acquired the remaining 49% interest in Nova Research. continued

Acetec Purchases Teradyne JTest Systems
The company has ordered 20 J750ExHD systems configured for digital wafer sort and final testing, enabling it to expand its market for production test services in the growing image sensor and mobile device segments. continued



Developer Interest in Augmented Reality Soars
ABI Research forecasts investments will reach $2.5 billion by 2018, driven by cloud computing, as it becomes a mainstream technology, making sensor data situational. continued

NanoMarkets to Release Smart Lighting Report
The analysis will compliment the May 2013 "Smart Lighting Markets and Opportunities 2013" report by pinpointing the driver, controller, and sensor chip requirements of current and future generations of smart lighting. continued

IHSI Enters Smart Transport Market
The IO Circuit investment opinion identifies the company as a new technology provider in the intelligent transportation system market. continued

Sensors TV


EVG Enhances EVG40NT Platform
The automated system's wafer-alignment metrology, coupled with the GEMINI FB system, creates a closed-loop fusion wafer-bonding system that promises to push the limits of 3D IC manufacturing for next-generation CMOS image sensors. continued

SSEC Introduces WaferEtch and WaferStorm
These platforms are configured for advanced packaging, MEMS, and compound semiconductor manufacturing to improve process control, reduced chemistry consumption, increase throughput, and reduce cost of ownership. continued

TI Announces Low-Power RF Transceiver
The SimpleLink Sub-1 GHz CC1200 delivers leading range and supports narrowband and wideband systems, with data rates up to 1 Mbps for smart grid, home and building automation, and IEEE 802.15.4g applications. continued

Perceptron Debuts ScanWorks xyz
The system is designed for retrofitting coordinate measuring machines and includes improvements that will enhance automated 3D scanning processes. continued

Maxim Offers T/C-to-Digital Converters
The company is now sampling the MAX31850 and MAX31851, 1-Wire thermocouple-to-digital converters that allow multiple sensor locations to communicate and draw power over a single data line, simplifying multi-sensor industrial and medical designs. continued


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