Log in     
Sensors Mag

Semiconductor 3D Equipment and Materials Consortium Created

October 11, 2006

Equipment providers, materials companies, and researchers join in an international consortium to address complex integration of thru-silicon-via (TSV) 3D chip interconnect technology for chip stacking and MEMS/sensors packaging.


SALZBURG, Austria /PRNewswire-FirstCall/ -- EMC-3D is a new consortium created to address the technical and cost issues of creating 3D interconnects using TSV technology for chip stacking and MEMS/sensors packaging. Several major equipment manufactures have joined with material companies to work with key research groups to address the issues of cost-effective manufacturing and integration. Equipment companies initiating the consortium are Alcatel, EV Group, Semitool , and XSiL.

Associate research members include Fraunhofer IZM, Samsung Advanced Institute of Technology, Korea Advanced Institute of Science and Technology, and Texas A&M University. Material members include Rohm and Haas, Honeywell, Enthone, and AZ, with wafer service support from Isonics.

The consortium will develop processes for creating micro vias between 5 and 30 µm on thinned 50 µm 300 mm wafers, using both via-first and via-last techniques. Major processes being integrated into the EMC-3D program are via etch and laser drill, insulator/barrier/seed deposition, micro via patterning with RDL capabilities, high aspect ratio Cµ plating, carrier bonding, sequential wafer thinning, backside insulator/barrier/seed deposition, backside lithography, backside contact metal plating, chip-to-wafer placement and attach, and dicing. In addition, wafer-to-wafer attach, dicing, and debonding will also be demonstrated. The cost of ownership goal for the integrated 3D process is $200 per wafer.

About EMC-3D (or EMC3D)
EMC3D (Semiconductor 3D Equipment and Materials Consortium) was created in September 2006 to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process. TSV processes will be developed for chip integration and MEMS/sensor packaging that are based on plated metal electrodes and thinned wafers. For more information, visit the consortium's Web site.

Contacts for EMC3D members include:

Equipment Members:
Alcatel, France: Jean-Marc Gruffat, director of business development
Technology: Si and dielectric etching using DRIE

EV Group, Austria: Thorsten Matthias, director of technology, North America
Technology: bonding, thin wafer handling, mask alignment lithography, conformal coat and develop

Semitool Inc, USA: Bioh Kim, director of 3D interconnect
Technology: electroplating, metal/barrier etch, photoresist strip, wafer cleaning and thinning

XSiL Ltd, Ireland: Richard F. Toftness, vice president of business development
Technology: Si laser machining, via drilling, and wafer dicing

Isonics Corp, USA: Kim Bell, director of sales
Technology: wafer service (reclaim and test wafers, wafer thinning, and thick-film SOI wafers)

Materials Members:
AZ Electronic Materials, USA: Aldo Orsi, global product manager
Technology: positive and negative acting photoresists

Enthone (Cookson Electronics), USA: Kristian Story, key account and regional line manager
Technology: chemistry for electroplating and metal etch

Honeywell Electronic Materials, USA: Brian Larabee, strategic marketing director
Technology: thermal spreaders, thermal interface materials, and electrical interconnect products

Rohm and Haas, USA: Bob Forman, advanced packaging business manager
Technology: chemistry for lithography, plating, etching, dielectric formation, and bonding

Technology Members:
Fraunhofer IZM, Germany: Jurgen Wolf, group and project manager
Korea Advanced Institute of Science and Technology, Korea: Dr. Kyung-Wook Paik, professor

Samsung Advanced Institute of Technology, Korea: Dr. Yoon-Chul Sohn, researcher
Texas A&M University, USA: Dr. Manuel Soriaga, professor


Add Comment




IIoT University


Deep Learning for Vision Using CNNs and Caffe: A Hands-on Tutorial – 9/22/16 – Cambridge, Mass


IDE






Sensors 2017 Call for Speakers


Sensors Midwest


Advertise


Subscribe



Twitter Feed

Find It Fix It Forum

Sensors invites you to join the Findit-Fixit Forum, where you can get answers to your sensing questions—concerning technologies, products, methods, applications, and services--and also offer help to your fellow engineers. The Forum covers all kinds of topics, from the basics to the extraordinary.

Join the discussion!


© Copyright 2016 Questex, LLC. All Rights Reserved. Sensorsmag. Privacy Policy | Terms of Use

If you are having technical difficulties or considerations, please contact the webmaster.