Log in     
Sensors Mag

New Book Covers MEMS Material Reliability

January 25, 2008

Research and Markets offers Reliability of MEMS, a book that covers the principles, tools, and methods for determining the reliability of microelectromechanical materials.


DUBLIN, Ireland--(BUSINESS WIRE)--Research and Markets has announced the addition of Reliability of MEMS to its offering.

This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies—nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.

Author Info Osamu Tabata received his Ph.D. degree from Nagoya Institute of Technology, Japan, in 1993. From 1981 to 1996, he performed industrial research at Toyota Central Research and Development Laboratories in Aichi, Japan. He then joined the Department of Mechanical Engineering of Ritsumeikan University in Shiga, Japan, and spent Guest Professorships at IMTEK Freiburg, Germany, and at ETH Zurich, Switzerland. In 2003, he joined the Kyoto University, Japan. Currently, he is the Professor at Micro Engineering Department. Professor Tabata is engaged in the research of micro/nano processes, MEMS and micro/nano system synthetic engineering (SENS). He was honoured with the Science News Award in 1987, Presentation Paper Award in 1992, and received the R&D 100 Award in 1993 and 1998, Best Poster Award of 19th Sensor Symposium on Sensors, Micromachines, and Applied Systems in 2002, Best Patent Award from Ritsumeikan University in 2004. He is a senior member of the Institute of Electrical Engineers of Japan, a member of the Japan Society of Mechanical Engineers and a senior member of the Institute of Electrical and Electronics Engineers.

Toshiyuki Tsuchiya received his Ph.D. degree from Nagoya University, Japan, in 2002. From 1993 to 2004, he carried out industrial research at Toyota Central Research and Development Laboratories in Aichi, Japan. In 2004, he joined the Department of Mechanical Engineering of Kyoto University and is currently Associate Professor in the Department of Microengineering. Toshiyuki Tsuchiya's current research is focused on mechanical properties evaluation of micro/nano materials and MEMS and micro/nano system synthetic engineering (SENS). He received the R&D 100 Award in 1998.

Contents

Introduction - Reliability Issues in MEMS
 

Part I: Mechanical Reliability of MEMS Materials
Mechanical Properties of MEMS Materials
Micro/Nano-Indenters
Bulge Methods
Bending Test using Probe Tools
Uni-axial Tensile Test with Specialized Chucking Methods
On-chip Microstructures
 

Part II: Reliability of MEMS Devices
Pressure Sensors
Inertial Sensors
RF MEMS
Optical MEMS
 

For more information visit the Research and Markets Web site.


Add Comment




IIoT University


Deep Learning for Vision Using CNNs and Caffe: A Hands-on Tutorial – 9/22/16 – Cambridge, Mass


IDE






Sensors 2017 Call for Speakers


Sensors Midwest


Advertise


Subscribe



Twitter Feed

Find It Fix It Forum

Sensors invites you to join the Findit-Fixit Forum, where you can get answers to your sensing questions—concerning technologies, products, methods, applications, and services--and also offer help to your fellow engineers. The Forum covers all kinds of topics, from the basics to the extraordinary.

Join the discussion!


© Copyright 2016 Questex, LLC. All Rights Reserved. Sensorsmag. Privacy Policy | Terms of Use

If you are having technical difficulties or considerations, please contact the webmaster.