HyperSilicon Becomes Tensilica Prototyping Partner in ChinaDecember 9, 2008
The Beijing-based company brings expertise in designing FPGA development boards, which are often used to test new chip designs before producing the chip in silicon.
SANTA CLARA, CA /BUSINESS WIRE/ -- Tensilica Inc. announced that HyperSilicon Co., Ltd., of Beijing, China, has become its newest SOC (system-on-chip) prototyping partner, supporting customers of both the Xtensa customizable processors and the Diamond Standard processor cores in the growing China market. HyperSilicon has particular expertise in designing FPGA development boards, which are often used to test new chip designs before producing the chip in silicon.
"We have seen great interest in Tensilica's dataplane processor cores in China," said Thomas Yan, Vice President of HyperSilicon. "By working together, we can provide cost-effective Altera FPGA–based boards for SOC emulation before silicon production and reduce verification time."
"Many companies prototype their SOC designs before committing them to silicon to make sure they'll work properly in the system," stated Chris Jones, Tensilica's Director of Strategic Alliances. "Hypersilicon's expertise can help these customers."
HyperSilicon Co., Ltd., is a private held company in Beijing, with a branch office in Shanghai, China. The company supplies FPGA-based rapid-prototyping board-to-SOC/IP designers, and the company is the sales agent of some worldwide IP vendors. StarFire series FPGA boards have been widely used in the China market and have helped customers decrease the time to market for various products. As the "first and only Development Kit Partner of Altera in China," the company is strong at customizing the FPGA board design.
Tensilica Inc. is the recognized leader in customizable dataplane processors. Dataplane Processor Units consist of performance-intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application-specific processor cores enable rapid customization to meet specific dataplane performance targets. Tensilica's DSPs and processors power top-tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products, including mobile phones, consumer electronic devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking, and communications equipment.
Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
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