e2v Unveils High Sensitivity Imaging SensorsMay 30, 2007
The new sensors use circuit-layer transfer technology from Tracit to provide back illumination capability, boosting sensor sensitivity.
Combining e2v's expertise with Tracit's circuit layer transfer technology delivers back-illumination capability to medium volume markets for the first time. This technology produces a dramatic improvement in sensor sensitivity when compared to a standard front-illuminated sensor. This makes the new e2v sensor an ideal solution for a broad range of applications, especially in medium volume, professional imaging sensor markets. It also complements e2v's existing back-illumination capability for low-volume markets like aerospace and life sciences.
"e2v's new sensor breakthrough is the combined result of our optimised manufacturing processes and Tracit Technologies' expertise," said Jean- Philippe Lamarcq, Imaging Business Unit General Manager at e2v, Grenoble. "We are proud to be first in the medium volume professional image sensor market to offer this innovative solution and see great potential, particularly in small-pixel CMOS sensors," he added.
"We are really pleased that Tracit's circuit transfer technology, coupled with e2v's proven expertise, has enabled the development of a new generation of image sensors from e2v," says Dr. Bernard Aspar, Founder and General Manager of Tracit Technologies. He added, "Our technology is now ready for reliable volume production. The ability to move finished circuits onto new supports is a promising way to improve device performance or to enable hetero-structure stacking for 3D integration."
About e2v technologies plc
e2v technologies is a leading designer, developer and manufacturer of specialized components and subsystems, falling within two product groups:
- Electronic tubes
- Sensors and Semiconductors
For the year ended 31 March 2006, e2v achieved sales of £112m and is listed on the London Stock Exchange (e2v.l). In July 2006 e2v technologies plc acquired a leading designer, manufacturer and distributor of specialised electronic components and sub-systems, based in Grenoble, France and in May of 2007 e2v plc acquired MiCS Microchemical Systems SA a designer and manufacturer of semiconductor based gas sensors. These acquisitions strengthen the Group's position as a major global provider of specialized electronic components and subsystems.
e2v's products are supplied into three core market areas:
- Medical & Science: Sensor technology includes imaging sensors for intra-oral and panoramic dental X-ray, mammography, life science applications and X-ray microscopy. Electronic tubes are the enabling technology behind radiotherapy cancer treatments, microwave medical therapy and high-energy physics.
- Aerospace & Defence: Sensor technology includes military surveillance, targeting and guidance, space-based imaging and astronomy, radar & electronic warfare and broadband data converters and microprocessors for aerospace applications. Electronic tubes provide the enabling technology behind radars, electronic countermeasures (ECM), electronic warfare and satellite communications.
- Commercial & Industrial: Sensor technology includes marine radars, industrial safety sensors, automotive radars and alarms, thermal imaging cameras used by fire fighters, CCD and CMOS high resolution line scan cameras for industrial inspection. Electronic tubes provide enabling technology behind TV broadcast, satellite communications, marine radar and food & industrial processing.
e2v has approximately 1,800 employees worldwide with three UK based manufacturing sites in Chelmsford, Lincoln, and High Wycombe, and one in Grenoble, France and one in Corcelles, Switzerland. In addition e2v has sales offices in the UK, USA, Germany and France and Hong Kong, as well as a network of distributors and representatives covering other key territories.
Further information on e2v technologies plc is available from its Web site.
About Tracit Technologies
Tracit Technologies specialises in thin-film layer transfer technologies that leverage direct wafer bonding and thinning processes. This technology allows to transfer fully processed layers as well as partially processed layers, onto various supports in order to achieve new structures. A recent strategic acquisition of the Soitec Group (Euronext, Paris), the world's leading innovator and provider of engineered substrates, its intellectual property is complementary to Soitec's Smart Cut(TM) technology. Tracit Technologies enables Soitec to expand its markets reach offering new engineered substrates (patterned BSOI, debondable BSOI etc.) for MEMS and Power ICs, as well as offering service access to its generic circuit transfer technology for applications such as image sensors and 3D integration. Following an initial development phase, Tracit Technologies, with its confirmed potential growth, is quickly moving to production to satisfy the needs of its customers throughout Europe, North America and Asia.
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