MEMS Track

 

Wednesday, June 6

10:20 AM - 11:00 AM
Sensor Fusion: Applications, Challenges and Solutions 
Stephane Gervais-Ducouret, Director for Sensors, Freescale

Improvement in performance and size, driven by MEMS technology, has enabled adoption of more sensors. Sensor fusion is enabling new applications like in-door navigation, health monitoring and context awareness. Sensor fusion challenges are reviewed and solutions, like the intelligent sensor platform, are proposed to ease adoption of multiple sensors.
● Explore innovative applications using different sensors, understand the intelligent sensor concept and its benefits.
● Technical challenges in sensors fusion like increased complexity, software, power consumption and effectiveness of data aggregation are describe with examples.
● How the intelligent sensor platform, which merges computing capabilities with sensors, is enabling sensor fusion, asymmetric processing, customization at sensors level and power consumption reduction.
● Overview of new applications enabled by sensors and sensors fusion: in-door navigation, health monitoring, context awareness, augmented reality.

 

11:10 AM -11:50 AM
New Dynamics of The MEMS Inertial Sensor Market
Laurent Robin, Technology & Market Analyst, Yole Developpement
Jeffrey Perkins, President, Yole Inc.

This overview of the inertial sensor market includes a market forecast for 2010-2016 for MEMS inertial sensors, with a special focus on MEMS accelerometers, MEMS gyroscopes, and magnetometers for consumer applications.
● Understand the latest market & technical challenges.
● Identify the key players of the inertial MEMS market industry.

 

1:50 PM - 2:30 PM
Co-design of Multi-sensor Micro-systems including Magnetic Devices
Mary Ann Maher, CEO, SoftMEMS LLC

Systems incorporating MEMS devices often include multiple MEMS sensors/actuators, analog and digital circuitry, micro-controller, custom packaging and dedicated software. Many of the delays in bringing these systems to market stem from errors made in integrating the MEMS sensors with the rest of the system causing costly re-designs. New co-design tools enable designers to collaborate to optimize the entire system and trade-off requirements between the MEMS and electronics, as well as communicate effectively to catch composition errors early in the design process. As a result, co-design reduces time to market for new products and increases system performance.
● How new software tools have been successfully deployed for the co-design of MEMS devices, their associated electronics and packaging in commercial MEMS systems.
● Highlights include examples of MEMS process-device co-design, MEMS and electronics co-design and MEMS, electronics and package co-simulation for systems involving magnetic sensors.
● Discussion of co-design tools for system designers integrating third party-supplied MEMS into commercial products. 

 

2:40 PM - 3:20 PM
An Integrated 6-axis MotionProcessor
Stephen Lloyd, Vice President of Engineering and New Product Development, InvenSense, Inc.

High-level technical features and inherent benefits of an integrated 6-axis MotionProcessor are discussed, including challenges using MEMS platform for multiple sensors. Also included are benefits of integrating multiple sensors onto a single substrate, reduced package size, simplified sensor interface, axis alignment, synchronized data, and local calculation of sensor fusion data.
● Hear the state of the art in MEMS inertial sensors.
● Understand the technology direction and roadmap of increasing sensor integration and what benefits this trend will provide.
● Understand the challenges of interfacing to individual raw inertial sensors, calculating a sensor fusion output vs. using a single MotionProcessor which directly provides 6 or 9 axis sensor fusion.

 

3:30 PM- 4:10 PM
Progress in Miniaturization of MEMS-Based Hybrid Integrated NIR Spectrometers
Heinrich Grueger, Group Manager Sensors Systems, Fraunhofer IPMS
Michael Scholles, Division Manager, Fraunhofer IPMS

NIR spectroscopy is a well-established tool for many kinds of analysis in different applications ranging from materials science to food, pharmacy, life science and security. Laboratory equipment is very expensive. Through the use of MEMS-based components the price can be reduced and the size now fits mobile applications.
● How MEMS based technology can help to make NIR spectroscopy available for high volume mobile applications.
● How hybrid integration can be used to miniaturize NIR spectrometer to the size of a sugar cube.
● What kind of applications benefit from miniaturized NIR spectroscopic systems.

 

Thursday, June 7

10:10 AM - 10:50 AM
High-Performance Inertial Sensors and Sub-Systems for Navigation and Stabilization Applications
Bobby Matinpour, PhD, Director, Product Marketing, Epson Electronics America, Inc.

This session highlights the state of the art in inertial sensors and sub-systems for navigation and stabilization applications, including the relevant performance parameters, an examination of the sources of measurement error, and the methods to reduce or mitigate their impact in the system.
● Learn about the latest in sensor technology in various technologies, including silicon and quartz.
● Overview of various inertial sensor products, such as gyro and accelerometer, and development trends.
● Understand the connection between the individual sensor elements and the performance of the end system.
● Methods for improving individual sensor performance and techniques to enhance end-system behavior using sensor fusion.
● Discover various new applications enabled by advances in miniaturization of high-performance sensors.

 

11:00 AM - 11:40 AM
Nano Scale Effects for Smart Systems Integration: From Nano to Macro
Mario Baum, Researcher, Fraunhofer ENAS
Claus Dittrich, Gemac mbH

This session discusses some important effects of downscaling, including their use in sensor systems and packaging technologies.
● The state of the art of nano effect integration in actual sensor developments.
● Latest examples of product development in the field of smart systems.
● Best practice examples for cooperative research work between private and public institutions.

 

1:40 PM - 2:20 PM
Second Generation Shock Tube Calibration System
David Wisniewiski, Principal Engineer, Meggitt

The shock tube is the ideal platform for performing dynamic calibrations of pressure transducers, both in terms of sensitivity and frequency response, and for overcoming the conspicuously absent nature of providing this quantifiable information, especially frequency response.
● Understand the importance of dynamic calibration of pressure transducers and the techniques for dynamic calibration.
● Why, with a frequency response (i.e. quantifiable transfer function), the pressure transducer used in a test application will permit better understanding of the physical measurement made by the user.

 

2:30 PM - 3:10 PM
MEMS in High Performance Audio
Rob OReilly, Senior Staff Engineer, Analog Devices Inc

Microphone technology used in high performance audio applications hasn’t changed much since the early 1950’s. MEMS microphones are providing audio engineers with a technology that will both improve audio performance and reduce cost. This technology enables improvements in noise cancellation, beam forming, directionality and proximity response.
● How MEMS microphones change the game in professional audio.
● Understand the process to develop a high performance microphone.
● Learn the types of applications requiring high performance microphones.
 

  

Don’t Forget to Check Out the MEMS Pavilion and MEMS Innovation Area on the Expo Floor featuring industry-leading MEMS players! Register today for a Main Conference Pass and gain access to the MEMS Conference sessions AND the Expo Floor Pavilion and Innovation Area. 



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