The MEMS piezoresistive low-pressure sensing die from All Sensors Corp., Morgan Hill, CA, is for high-volume applications that require pressure measurements as low as 0.25 in.H₂O F.S. The new die uses an open-bridge configuration, is 2 by 2 mm, and uses a boss-less structure to minimize position sensitivity to 0.1% in.H₂O typ. while maximizing pressure response. Applications include HVAC variable air volume controls, automotive fuel vapor recovery systems, medical air flow, and portable/handheld devices.