Low-Pressure Die from All Sensors
All Sensors Corp.
May 16, 2010
All Sensors Corp., Morgan Hill, CA, offers a low-pressure MEMS sensor die for high-volume applications that require pressure measurement as low as 0.25 in.H2O F.S. The piezoresistive die has an open-bridge configuration, is 2 by 2 mm, and features a bossless structure to minimize position sensitivity. The proprietary Colinear Beam technology uses silicon-based longitudinal and transverse strain technology; strain-sensitive resistors are processed to allow either constant current or voltage excitation through selection of temperature coefficients of resistance and sensitivity. Dies are available in ranges from 5 in.H2O to 30 in.H2O.
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