Embedded Systems

Multifunction DAQ Boards Provide Two Analog Outputs


Multifunction DAQ Boards Provide Two Analog Outputs
Measurement Computing Corp.
November 21, 2014

The USB-230-OEM Series 16-bit multifunction data-acquisition (DAQ) boards provide two analog outputs and deliver sample rates up to 100 ksamples/s. Features include eight SE/4 DIFF analog inputs, eight individually-configurable digital I/Os, one 32-bit counter input, two 16-bit analog outputs, no external power required, and a Micro-USB Type B connector. The board comes with TracerDAQ software. Universal Library includes support for Visual Studio and Visual Studio .NET, including examples for Visual C++, Visual C#, Visual Basic, and Visual Basic .NET. Supported operating systems include Windows 8/7/Vista/XP, 32-bit or 64-bit. A datasheet is available at http://www.mccdaq.com/PDFs/specs/USB-230-Series-data.pdf

Measurement Computing Corp.
Norton, MA
800-234-4232
508-946-5100
info@mccdaq.com
http://www.mccdaq.com


CONTACT INFO

CompanyMeasurement Computing Corp.
CountryUnited States (USA)
Emailinfo@mccdaq.com
Phone800-234-4232/508-946-5100
Fax508-946-9500
URLhttp://www.mccdaq.com/
AC/DC Supplies

Low-cost Compact Switchers Deliver 5W To 30W


Low-cost Compact Switchers Deliver 5W To 30W

November 21, 2014

The APC, ATC, ANCN, and ASC series of ac/dc switching power supply modules are available in output power ranges of 5W, 10W, 15W, and 30W, respectively, and single and dual outputs from 3.3 to 24 Vdc. All models feature fully encapsulated packaging and are suitable for board-mounted power applications. Features include efficiency up to 75%, low output ripple and noise, and an input range from 90 to 264 Vac. Prices start at $36 in moderate quantities. Datasheets are available at:

APC 5W: http://beta-dyne.com/pdf/apc_5rA1.pdf
ATC 10W: http://beta-dyne.com/pdf/atc_10rA1.pdf
ANCN 15W: http://beta-dyne.com/pdf/ancn_15rA1.pdf
ASC 30W: http://beta-dyne.com/pdf/ASC_30rA1.pdf

Beta Dyne Inc.
Bridgewater, MA
508-697-1993
info@beta-dyne.com
http://www.beta-dyne.com


CONTACT INFO

CompanyBeta Dyne Inc.
CountryUnited States (USA)
Tech & Product

1-MHz, 18-bit ADC Operates In Temperatures from -55°C to +125°C


1-MHz, 18-bit ADC Operates In Temperatures from -55°C to +125°C
Datel Inc.
November 21, 2014

Heralded as a first, the ADS-951 series 1-MHz analog-to-digital converters (ADCs) offer 18-bit resolution and are housed in a 32-pin hermetically sealed ceramic package. With a choice of three standard temperature ranges: 0 to +70°C, -40°C to +100°C, and -55°C to +125°C. The ADS-951 requires only the rising edge of the start convert signal to operate and dissipate less than 400 mW. It requires no external components and all supporting features from front end signal conditioning/driver amplifiers, reference, digital drivers, and decoupling passive components are included in one package. A datasheet is available at http://www.datel.com/data/ads/ads951.pdf  

Datel
Mansfield, MA
508-339-3000
http://www.datel.com


CONTACT INFO

CompanyDatel Inc.
CountryUnited States (USA)
Phone508-339-3000
URLhttp://www.datel.com/
Software

APEI Builds the First Multiphysics Simulation App with the Application Builder


APEI Builds the First Multiphysics Simulation App with the Application Builder
COMSOL
November 21, 2014

BURLINGTON, MA -- Last month marked the release of the revolutionary Application Builder, now available with COMSOL Multiphysics software version 5.0. The Application Builder, which allows COMSOL® software users to build an intuitive interface to run any COMSOL model, has been very well received by the engineering community. COMSOL Multiphysics users are already building applications and exploring the benefits of sharing their models with colleagues and customers worldwide.

Application Builder Set to Expand Access to Simulation

One such company is Arkansas Power Electronics Intl. (APEI), a manufacturer of high power density and high performance power electronics products. APEI has found that the Application Builder can provide enormous benefits throughout the organization.

“I’m building applications to help us expedite our design processes,” says Brice McPherson, a Senior Staff Engineer at APEI. “Our engineers often spend time running analyses for the sales or manufacturing departments to find model results based on diverse conditions and requirements. The Application Builder will be hugely important for accelerating our work in this respect; any colleague outside of the engineering team will now be able to confidently run these studies by themselves, with no learning curve.”

The first application built by APEI looks at fusing current and ampacity of wire bonds – very small wires used to interconnect semiconductor devices with their packages. “Designing a new wire bonding scheme for a power semiconductor usually requires a simulation specialist, who needs to spend time setting up the model and analyzing the temperature increase under a variety of conditions,” says McPherson. “We decided to use this common design request to take a first look at the Application Builder and to aid our colleagues working in manufacturing.”

Bond wires used as interconnects in semiconductor devices must be properly sized and arranged to minimize heating. Top: A parametric sweep created by the user for a specific wire diameter, current, loop height, ambient temperature, bond length, and number of bonds shows the relationship between the number of bonds and the temperature in the interconnect. Another tab in the application (bottom) helps the user select the appropriate wire diameter, loop geometry, and number of wires to find the maximum current the bonds can carry without overheating.

“The Application Builder let us build a powerful, yet easy-to-use application,” says McPherson. “When dealing with power, we have to be mindful of how much current we can safely transfer through the wires. This is heavily dependent on the geometry of the wire and the loop. One function of the app we created (see above figure, left) uses a parametric sweep to show how the number of wires affects the peak wire temperature at a set current. Previously, we had to look these values up using tables that we generated from many sweeps in COMSOL Multiphysics,” McPherson continues. “Now we can have a clean, simple application to get that data without requiring an engineer, and the results are more accurate than what we would have achieved using the tables, since the information provided in the app is generated on a case-by-case basis.”

The team at APEI envision using the Application Builder for countless other projects in the months to come, including applications to automate and streamline the calculation of wire bond inductance, package thermal performance, inductor and transformer design, and layout analysis, just to name a few. “The Application Builder surpassed my expectations,” McPherson concludes. “It’s very easy to use – our first application was running smoothly in minutes. The Form Editor is powerful and accessible, as it uses the same structure, format, and interaction as the COMSOL environment. If you can build a COMSOL model, it takes little effort to build an application, and the benefits will be felt by many APEI employees.”

For more details, visit http://www.comsol.com


CONTACT INFO

CompanyCOMSOL
Temperature

Atmel Launches Industry's First Wide-Vcc, Low-Power Temperature Sensor Family

November 21, 2014

New Family Improves System Reliability, Reduces Overall System Cost and Lowers Power Consumption, Ideal for Consumer, Industrial, Computer and Medical Applications



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Tech & Product

Microsemi Leads in Timing Solutions With Ultralow Jitter OTN Clock Translator in the Smallest Footprint

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Leak/Level

UL listing for the Baumer CleverLevel LBFS/LFFS level switch

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Medical

Gladius 5 Rugged Android Tablet and Smartphone Redefines Mobile Healthcare Computing

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Customizable Mobile Health Device from Arbor Solution Perfect for Everything from Hospitals to Home Health to Pharmacies



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Temperature

Temperature Sensors Market Worth $6.05 Billion by 2020

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MEMS

SPTS Technologies Named MEMS/Sensors Supplier of the Year

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