University of Michigan to Use EVG Wafer BondersMarch 3, 2010
The school’s Lurie Nanofabrication Facility will use the technology for advanced MEMS research.
St. Florian, Austria /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF), a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation. With a wafer bonder and aligner already installed at the facility, the new systems will increase the level of the university's overall MEMS research efforts by providing high-force wafer bonding capabilities. This order marks a strategic win for EVG as it poises the company for a long-term relationship with another major university with a strong MEMS research focus, and further expands EVG's overall presence in the university R&D arena.
Selected for their repeatability, reliability, and technical support network, the bonding systems—an EVG 520IS and an EVG510—are undergoing installation at the customer site with completion targeted for Q1 this year. The wafer bonders will be used for a wide-range of MEMS-related research in fields such as biomedical, environmental, and optoelectronics. Both systems offer unique high-force bonding capabilities that would enable metal-to-metal bonding and specifically allow triple stack anodic bonding, for instance. The flexibility in force, as well as bonding form (e.g., anodic, eutectic, polymer, thermo-compression, and direct), that the systems offer will expand the research facility's processing capabilities.
"As a member of NNIN, we are always looking for the most advanced technical processing capabilities—not only for our own research efforts, but also in the interest of other research groups dedicated to advancing MEMS technology," said Professor Ken Wise of the University of Michigan and Director of the Lurie Nanofabrication Facility. "Following thorough evaluation of a number of wafer bonding systems, we selected EVG's bonding solutions for their superior technology capabilities. The combination of EVG's demo results, strong support network, and the affordability of their system were all critical to our decision."
Steven Dwyer, Vice President and General Manager of EV Group North America, noted, "University of Michigan's Lurie Nanofabrication Facility is a stellar university research organization, and we are thrilled that our systems were selected over the competition. The LNF has demonstrated the utmost confidence in our technology and technical support capabilities, which is testament to the strength of our solutions as well as our customer support team. We look forward to a long-term collaborative partnership with the LNF."
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS, and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), and metrology equipment, as well as photoresist coaters, cleaners, and inspection systems.
In addition to its "dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS." Along these lines, the company co-founded the EMC- 3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor, and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea; and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges, and expedite device manufacturing in high volume.
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