Machine Manufacturing

Teledyne DALSA Launches New MIDIS System

June 5, 2013

The MEMS fabrication platform enables the manufacture of high-volume, low-cost accelerometers and gyroscopes for consumer, automotive, and sports/health applications.

WATERLOO, ONTARIO /Marketwired/ -- Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices. The platform is designed to provide high-volume, low-cost manufacture of accelerometers and gyroscopes or the integration of both into an inertial measurement unit, addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.

"Our MIDIS platform is a break-through technology that greatly reduces time to market by using a standardized process rather than developing each new device from the ground up, while making no compromises in performance," said Donald Robert, VP of Marketing at Teledyne DALSA Semiconductor. "Our high-performance through-silicon via and wafer bonding approach provide high vacuum and hermeticity without the need for expensive getters, in a very compact wafer-level package."

Key Features and Benefits

  • Low product cost is achieved by reducing die size and by eliminating getter.
  • The standardized process reduces time to market, cost, and development time.
  • High-vacuum and hermeticity allows resonator Q factors > 20,000.
  • Efficient wafer-level packaging minimizes overall die size.
  • Comprehensive design rules maximize yield and reliability.

Sensors fabricated using Teledyne DALSA's MIDIS platform are already sampled or in production with alpha customers, and the platform is now being made available to the general market. For more information, contact To learn more about the MIDIS platform, visit the company's Web site.

Webcast: Introducing MIDIS Platform
Interested in learning more about the MIDIS platform? Register for our live webcast, which will take place on June 27, 2013. During the webcast, Luc Ouellet, VP of Technology Development at Teledyne DALSA Semiconductor, and Laurent Robin, Technology and Market Analyst for Inertial MEMS Devices and Technology at Yole Developpement will explain the finer points of this breakthrough new platform and the exciting possibilities it enables for consumer device designers.

About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs.

About Teledyne DALSA
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high-performance digital imaging and semiconductors, with approximately 1000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing MEMS products and services.

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