Amkor to Install SUSS MicroTec SystemsMarch 11, 2010
The equipment package includes MA300 Gen2 mask aligner systems and ACS300 Gen2 wafer processing clusters for wafer level packaging, wafer bumping, and 3D integration technology.
Garching/Munich, GERMANY -- SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry, has received orders for multiple 300 mm lithography systems from Amkor Technology Inc., an industry leading supplier of innovative packaging solutions. The equipment package includes MA300 Gen2 mask aligner systems and ACS300 Gen2 wafer processing clusters for wafer level packaging, wafer bumping, and 3D integration technology. Installations at Amkor's K4 plant in Gwangju, Korea, and T1 fab in Hsin-Chu, Taiwan, are scheduled to be completed in Q3 2010.
"As a contract manufacturer for semiconductor companies worldwide, we are committed to bringing leading-edge packaging solutions to market", said Choon Heung Lee, CVP and CTO, Amkor Technology. "USS MicroTec's lithography systems have been an integral part of our success and have set an exceptional track record for process capability, reliability, support, and overall cost of ownership for our worldwide operations."
"We are looking forward to providing additional system solutions to meet Amkor's capacity expansion requirements. We truly value our relationship with this key customer," said Frank Averdung, President and CEO, SUSS MicroTec, "These multiple tool orders further solidify the leading position of our 300 mm lithography equipment for the advanced packaging market."
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