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Sensor industry news including contracts, awards, collaborations, acquisitions, and highlights of new measurement & sensor technology.


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TenCate and Roctest Create Geotextile Monitoring System   March 17, 2010

Under the collaboration, the two companies will combine their fiber-optic sensor and geosynthetics expertise to develop a geotextile monitoring system.More>>

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Soitec Supplying SOI substrates to CSMC   March 17, 2010

The substrates will be used for display and other applications; the company cites high interest and support in China for SOI projects.More>>

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Capella, Innovative Micro Technology (IMT) Collaborate   March 17, 2010

Under the strategic foundry relationship, the companies will collaborate to enable next-generation MEMS wavelength selectable switches.More>>

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Energy Optimizer Integrates Data from External Systems   March 17, 2010

Using an array of new software connectors, Arch Rock's energy monitoring system brings data from servers, power, and cooling systems to gives users actionable information and cost-effective energy-monitoring choices.More>>

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Disruptive Technologies in the Future of Digital Imaging   March 16, 2010

Research and Markets new report considers CMOS image sensors technologies & markets.More>>

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MISTRAS Group Develops Online Monitoring System   March 16, 2010

The monitoring system, developed in collaboration with the Florida Power & Light Co., detects mid-compressor stator cracking in GE 7FA combustion turbines.More>>

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FreeFlight Systems GPS Sensor Chosen for ADS-B Testing   March 16, 2010

FAA uses the 1203's WAAS GPS capability to verify Alaskan ADS-B coverage is working correctly.More>>

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Industrial Wireless Temperature Transmitter Powered by Heat   March 16, 2010

ABB and Micropelt prove thermal energy harvesting to solve the battery issue of wireless sensors.More>>

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CalAmp and Kepware to Partner   March 11, 2010

CalAmp licenses Kepware technology for its distributed wireless communications processor, designed for SmartGrid applications.More>>

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Amkor to Install SUSS MicroTec Systems   March 11, 2010

The equipment package includes MA300 Gen2 mask aligner systems and ACS300 Gen2 wafer processing clusters for wafer level packaging, wafer bumping, and 3D integration technology.More>>