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News and information on new sensor technologies and other sensor-related R&D efforts.

CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology   December 9, 2013

CEA-Leti announces an agreement with Qualcomm Technologies, Inc. to assess the feasibility and the value of Leti’s sequential 3D technology.More>>

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Evaluation Kit Puts A Spin On BLDC Motors   December 6, 2013

To assist in the design process, Allegro MicroSystems offers an evaluation kit for its A4915 three-phase MOSFET controller for brushless dc (BLDC) motors. More>>

Ceresana Presents the First Complete Analysis of the Market for Styrene   December 6, 2013

In the recently published study, the market research institute Ceresana comprehensively analyzes and describes the development of the global market for styrene. More>>

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Phase Adjustable Connector Is Now Solderable   December 5, 2013

Coaxicom’s 3993-2 phase-adjustable connector is now available with a direct solder solution for RG402, 0.141 semi-rigid and ultra-flex cables. More>>

Sidense White Paper Discusses the Use of 1T-OTP Memory for Optimizing Sensor Performance    December 4, 2013

Sidense has released a white paper, "Optimizing Sensor Performance with 1T-OTP Trimming," discussing the advantages of using antifuse-based one-transistor, one-time programmable (1T-OTP) memory to trim sensors.More>>

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Single-Phase Power Analyzer Delivers Fast and Accurate Results   December 3, 2013

Claiming best-in-class accuracy, bandwidth, and the most complete feature set available, the PA1000 single-phase power analyzers from Tektronix feature a patent-pending Spiral Shunt design that enables accurate power measurements in the shortest possible time. More>>

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Hands-Free Light Source Eases Yoke Inspection   December 3, 2013

Spectronics’ EK-3000 EagleEye UV-A/white-light LED inspection kit is suitable for a number of apps, particularly magnetic-particle inspection. More>>

Joint Initiative to Advance MEMS Technologies   November 27, 2013

The A*STAR Institute of Microelectronics, GLOBALFOUNDRIES Singapore, and the Masdar Institute of Science and Technology will develop inertial sensors, energy harvesters, nano-opto-mechanical sensors, and ultrasonic transducers.More>>

Imec Integrates CCD and CMOS Technology   November 27, 2013

The prototype image sensor combines a light-sensitive, CCD-based TDI pixel array with peripheral CMOS electronics to deliver low-noise performance in the charge domain and fast, complex circuitry readouts.More>>

Freescale Unveils High-Speed CAN Transceivers   November 26, 2013

The MC33901 and MC34901 chokeless physical layer transceivers feature ultra-low-quiescent current to address the stringent electromagnetic compatibility requirements of industrial and automotive applications without external noise filtering.More>>

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