X-FAB Foundry to Provide Ready-to-Use Hall SensorNovember 30, 2010
New device and design kit add-on for XH018 high-voltage process reduces design time and cost for System-on-Chip (SoC) designs.
ERFURT, Germany, -- X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in "More than Moore" technologies, became the first pure-play foundry to deliver integrated Hall effect functionality as a fully characterized, documented and ready-to-use Hall sensor device. Implemented in X-FAB's 0.18 micrometer high-voltage process technology (XH018), the new low-power, highly sensitive magnetic field sensor device is a perfect fit for battery-powered applications. It allows engineers to change the system architecture of the entire sensing application into a more cost-effective single-chip solution that requires no further layout work, additional chip testing, measurements or optimization. X-FAB also is delivering a design kit add-on that provides everything designers need to successfully integrate this device with the rest of the circuitry on the chip. X-FAB will thoroughly discuss its Hall sensor offering in a free webinar, "Foundry Solution for Hall Sensor Applications—Integrated Magnetic Field Sensing Made Easy with Ready-to-Use Hall Device," offered worldwide on December 8 and 9.
The new Hall sensor is suitable for contactless detection or measurement of magnetic fields, and for applications in which a magnetic field is used to indirectly measure distance, position, rotational angle, speed or an electric current. For example, it can be used as a proximity sensor for handhelds, an automotive vehicle speed sensor, a replacement for mechanical switches, a brushless control for DC motors, a fluid level detector or a meter for smart grid applications. The new sensor operates with a very small supply current and is fully characterized including offset, sensitivity and temperature dependency. Offered as an IP block, the ready-to-use Hall sensor primitive device is available now for customer tape-ins.
The design kit add-on includes a VerilogA model to enable simulations for X-FAB's modular XH018 process. This process meets the rigorous automotive qualification standards and enables SoC design engineers to integrate Hall effect functionality along with offset compensation and precise signal conditioning, high-density logic, microprocessor cores, non-volatile memory, high-voltage analog devices and power drivers. Using the ready-to-use Hall sensor device leads to significant time and cost savings in the design process.
X-FAB's new Hall sensor is available now. Silicon samples for evaluation purposes are available on request. The design kit can be downloaded from X-FAB's online technical information center, X-TIC.
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.18 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors.
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