FlipChip and Fujikura to CollaborateJune 13, 2012
The two companies announced a strategic business agreement that allows both parties to combine technology development, design, sales, and marketing for the ChipletT and ChipsetT ultra-low-profile embedded semiconductor package product lines.
PHOENIX /PRNewswire/ -- FlipChip International LLC (FCI) of Phoenix, AZ, (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) announced conclusion of a joint strategic sales and business development agreement. The agreement will allow both parties to combine technology development, design, sales, and marketing for their recently launched ChipletT and ChipsetT ultra-low-profile embedded semiconductor package product lines, based on both the Fujikura's WABE Technology and the WLCSP expertise of FCI. This is a further consolidation of the partnership between the companies and an important milestone in providing customers with industry-leading supply chain logistics, coupled with a seamless and efficient design-to-manufacture service.
This collaboration between FCI and Fujikura is another step toward a true turn-key service business model that provides the customer with improved design and commercial responsiveness, supply chain and yield management, consolidated design teams, and reduced lead times for prototyping and production.
ChipletT and ChipsetT products will provide breakthrough low-cost packages, using a flexible printed circuit (FPC) format. ChipletT and ChipsetT will service the +$22 billion semiconductor packaging market, with targeted end markets of smartphones, tablets, medical diagnostics, advance server farms, automotive, security, sensors, and photovoltaics where ultra-thin and very low-cost chip packaging enables innovative products and designs. ChipsetT provides a package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density. The embedded FPC-based technology also delivers improved product reliability and system performance, thus conserving vital battery life.
Flip Chip International, said, "We are excited to announce this partnership expansion with Fujikura. We believe that a true turnkey service provision is key for our customers and dramatically eases technology adoption, simplifies supply chain logistics, and reduces time to market. Our goal is to deliver innovative, cost-effective packaging solutions that offer our customers real product value add, coupled with outstanding reliability."
Fujikura, said, "We strongly recognize that the tight partnership with FCI is the key for success in this business. We believe that the expansion of our partnership will provide a very useful one-stop solution for many of our customers in the semiconductor field."
FlipChip International LLC (FCI) is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. FlipChip is a recognized leader in WLCSP and flip chip bumping. FlipChip is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets.
Fujikura Ltd. is a global supplier of optical transmissions systems, network systems, electronic materials, power systems, coated wires, magnet wires, electronic materials for equipment, and metallic materials. For 120 years, Fujikura has been providing "Tsunagu" (connection) technologies.
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