Cymbet Teams with MicrossMay 8, 2012
The two companies will collaborate to supply embedded energy solutions for multi-chip packages, offering EnerChip solid-state batteries and ultra-low-power management ICs in bare die format.
Minneapolis -- Cymbet Corp. announced that it is teaming with Micross Components to distribute and package Cymbet's entire family of EnerChip smart solid-state batteries and ultra-low-power management IC solutions in bare die form. Cymbet's EnerChips are constructed on silicon wafers, using semiconductor processing techniques that make them perfect for co-packaging with other ICs carried on the Micross line card. Energy storage can now be embedded directly into a single miniature multi-chip package. Embedded energy opens up new innovative product capabilities that previously could not be realized with legacy energy storage devices.
"Micross Components is an ideal partner for Cymbet as they specialize in bare die distribution and high-reliability microelectronics component assembly and integration," said Bill Priesmeyer Cymbet CEO. "The aim of Micross is to provide a single solution to a customer's requirements, and now they can offer integrated EnerChip batteries that will solve previously unmet needs."
EnerChips Solid-State Batteries
The EnerChip solid-state batteries have a footprint as small as the CBC005 bare die that is 1.375 mm by 0.85 mm by 200 microns thick. CBC012 and CBC050 provide more energy storage in similarly small footprints. In addition, Micross will be offering the CBC910 EnerChip power management IC bare die that provides all the functions listed in the Cymbet EnerChip CC series of products. Background information on EnerChip bare die can be found on the company's Web site.
"We are extraordinarily pleased to have Cymbet as our embedded energy partner," said Tony Hamby Micross General Manager. "Combining the EnerChip battery line with the wide range of components that we already offer in die format, enhances our ability to act as a comprehensive IC solutions provider to the high-reliability markets we support—defense, space, medical, oil, and energy exploration."
Evaluate EnerChips as Packaged Parts Before Designing with Bare Die
Cymbet makes it easy to experiment with EnerChip solidstate batteries before using bare die by using one of two EnerChip CC evaluation kits:
- The CBC-EVAL-05 EnerChip CC evaluation kit contains everything needed to test EnerChip 12 µAh and 50 µAh thin-film batteries, EnerChip CC CBC3112, and CBC3150 batteries with integrated battery management, and multiple batteries in parallel. This kit will also include a CBC3105 evaluation board for experimenting with this tiny 4 mm by 5 mm packaged device. Using an EnerChip bare die solution from Micross enables an even smaller footprint implementation.
- CBC-EVAL-06 real-time-clock evaluation kit includes a Microcrystal NV2123 real-time clock device and a CBC3112 EnerChip CC for battery backup. This kit also includes a Windows-based graphical user interface to set the clock and test RTC operation in backup and countdown modes.
"Included with all Cymbet evaluation kits are full datasheets and application notes that include reference designs and schematics," said Steve Grady, Vice President of Marketing at Cymbet. "We provide all the information designers need for easy EnerChip bare die integration into their new products on the company Web site."
Cymbet Corp. is a leader in solid-state energy storage solutions for microelectronic systems. The company is the "first to market eco-friendly rechargeable solid-state batteries that provide electronic systems designers with new embedded power capabilities." The company's EnerChip devices enable new concepts in energy storage application for ICs and new products for medical, sensors, RFID, industrial control, communications, and portable electronic devices.
About Micross Components
Micross Components is a leading global provider of specialty electronic solutions for defense, space, medical, and demanding industrial applications. Operating as a single source for high-reliability and state-of-the-art electronics, Micross' offerings range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 30+ year heritage, Micross possesses the design, manufacturing, and logistics expertise needed to support an application from start to finish.
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