BeSang and SK Hynix Sign Licensing AgreementOctober 31, 2013
The agreement covers the use of BeSang's patented innovations to be implemented in a broad range of 3D IC products offered by SK Hynix.
BEAVERTON, OR /PRNewswire/ -- BeSang Inc., the pioneer in TRUE 3D IC solutions, announced it has signed a patent license agreement with SK Hynix Inc. This license agreement covers the use of BeSang's patented innovations to be implemented in a broad range of 3D IC products offered by SK Hynix Inc.
"SK Hynix is a top global semiconductor industry leader. Therefore, SK Hynix is an important customer, and this agreement validates the strength of BeSang's TRUE 3D IC solutions," said Dr. Sang-Yun Lee, CEO of BeSang Inc. "We look forward to the opportunity to expand our customer relationships beyond patent license agreements to showcase our technical contributions and know-how with customers."
BeSang's TRUE 3D IC technology enables vertical stacking of multiple device layers and offers low-cost and high-performance solutions to CPU, DSP, GPU, ASIC, FPGA, SoC, DRAM, SRAM, flash, image sensor, and SSD applications. BeSang has successfully demonstrated its disruptive TRUE 3D IC technologies in 2008.
BeSang Inc. is a pioneer in the design, development, and delivery of unsurpassed 3D IC solutions, providing unmatched process and design technologies for TRUE 3D IC, as well as technology licenses to customers. BeSang provides high-value intellectual properties related to its proprietary TRUE 3DM ICs. The fabless semiconductor company is headquartered in Beaverton, OR, USA.
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